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INTEGRATED CIRCUITS
DATA SHEET
PCA8581; PCA8581C 128 x 8-bit EEPROM with I2C-bus interface
Product specification Supersedes data of 1996 Aug 19 File under Integrated Circuits, IC12 1997 Apr 02
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
CONTENTS 1 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.5 8 9 10 11 12 12.2 12.2 12.3 13 14 14.1 14.2 14.2.1 14.2.2 14.3 14.3.1 14.3.2 14.3.3 15 16 17 FEATURES GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING CHARACTERISTICS OF THE I2C-BUS Bit transfer Start and stop conditions System configuration Acknowledge I2C-bus protocol LIMITING VALUES HANDLING DC CHARACTERISTICS AC CHARACTERISTICS APPLICATION INFORMATION Application example Slave address Diode protection PACKAGE OUTLINES SOLDERING Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS
PCA8581; PCA8581C
1997 Apr 02
2
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
1 FEATURES 2
PCA8581; PCA8581C
GENERAL DESCRIPTION
* Operating supply voltage: - 4.5 to 5.5 V (PCA8581) - 2.5 to 6.0 V (PCA8581C) * Integrated voltage multiplier and timer for writing (no external components required) * Automatic erase before write * Low standby current; maximum 10 A * 8-byte page write mode * Serial input/output bus (I2C-bus) * Address by 3 hardware address pins * Automatic word address incrementing * Designed for minimum 10000 write cycles per byte * 10 years minimum non-volatile data retention * Infinite number of read cycles * Pin and address compatibility to PCF8570C and PCF8582 * Operating ambient temperature: -25 to +85 C. 3 QUICK REFERENCE DATA SYMBOL VDD PARAMETER supply voltage PCA8581 PCA8581C IDD Tamb Tstg supply current (standby) operating ambient temperature storage temperature
The PCA8581 and PCA8581C are low power CMOS EEPROMs with standard and wide operating voltages: 4.5 to 5.5 V (PCA8581) 2.5 to 6.0 V (PCA8581C). In the following text, the generic term `PCA8581' is used to refer to both types in all packages except when otherwise specified. The PCA8581 is organized as 128 words of 8-bytes. Addresses and data are transferred serially via a two-line bidirectional bus (I2C-bus). The built-in word address register is incremented automatically after each written or read data byte. All bytes can be read in a single operation. Up to 8 bytes can be written in one operation, reducing the total write time per byte. Three address pins, A0, A1 and A2 are used to define the hardware address, allowing the use of up to 8 devices connected to the bus without additional hardware.
CONDITIONS
MIN. 4.5 2.5
MAX. 5.5 6.0 10 +85 +150 +85 V V
UNIT
fSCL = 0 Hz without EEPROM retention with EEPROM retention
- -25 -65 -65
A C C C
4
ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DIP8 DIP8 SO8 SO8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 3.9 mm plastic small outline package; 8 leads; body width 3.9 mm VERSION SOT97-1 SOT97-1 SOT96-1 SOT96-1
PCA8581P PCA8581CP PCA8581T PCA8581CT
1997 Apr 02
3
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
5 BLOCK DIAGRAM
PCA8581; PCA8581C
handbook, full pagewidth
TIMER
VOLTAGE MULTIPLIER
PCA8581 PCA8581C
WORD ADDRESS REGISTER A0 A1 A2 SCL SDA 5 1 2 3 6 INPUT FILTER I C BUS CONTROL
2
7
ROW SELECT
MEMORY CELL ARRAY
COLUMN SELECT
MULTIPLEXER
VDD VSS TEST
8
POWER ON RESET
SHIFT REGISTER
8
R/W CONTROL
4 7
MLB887
Fig.1 Block diagram.
6
PINNING SYMBOL PIN 1 2 3 4 5 6 7 8 DESCRIPTION hardware address input 0 hardware address input 1 hardware address input 2 negative supply serial data input/output serial clock input test output can be connected to VSS, VDD or left open-circuit positive supply
fpage
A0 A1 A2 VSS SDA SCL TEST VDD
A0 A1 A2 VSS
1 2 3 4
MLB888
8
VDD TEST SCL SDA
PCA8581 PCA8581C
7 6 5
Fig.2 Pin configuration.
1997 Apr 02
4
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
7 CHARACTERISTICS OF THE I2C-BUS 7.1 Bit transfer
PCA8581; PCA8581C
The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only when the bus is not busy.
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal.
SDA
SCL data line stable; data valid change of data allowed
MBA607
Fig.3 Bit transfer.
7.2
Start and stop conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the stop condition (P).
SDA
SDA
SCL S START condition P STOP condition
SCL
MBA608
Fig.4 Definition of START and STOP conditions.
1997 Apr 02
5
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
7.3 System configuration
PCA8581; PCA8581C
A device generating a message is a `transmitter', a device receiving a message is the `receiver'. The device that controls the message is the `master' and the devices which are controlled by the master are the `slaves'.
SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER
MBA605
SLAVE RECEIVER
MASTER TRANSMITTER
Fig.5 System configuration.
7.4
Acknowledge
The number of data bytes transferred between the start and stop conditions from transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge bit. The acknowledge bit is a HIGH level signal put on the bus by the transmitter during which time the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter.
The device that acknowledges must pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse (set-up and hold times must be taken into consideration). A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a stop condition.
handbook, full pagewidth
START condition SCL FROM MASTER 1 2 8
clock pulse for acknowledgement 9
DATA OUTPUT BY TRANSMITTER S DATA OUTPUT BY RECEIVER
MBA606 - 1
Fig.6 Acknowledgement on the I2C-bus.
1997 Apr 02
6
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
7.5 I2C-bus protocol
PCA8581; PCA8581C
Before any data is transmitted on the I2C-bus, the device which should respond is addressed first. The addressing is always carried out with the first byte transmitted after the start procedure. The I2C-bus configuration for the different PCA8581 WRITE and READ cycles is shown in Figs 7, 9 and 10.
handbook, full pagewidth
acknowledgement from slave
acknowledgement from slave
acknowledgement from slave
S
SLAVE ADDRESS
0AX
WORD ADDRESS
A
DATA
A
P
WRITING
R/W don't care
n bytes auto increment memory word address
t WR
MLB889
Fig.7 Master transmits to slave receiver (WRITE) mode.
After the word address, one-to-eight data bytes can be sent. The address is automatically incremented, but the four highest address bits (row) are internally latched. Therefore all bytes are written in the same row. An example of writing eight bytes with word address X 0 0 0 0 0 0 0 and six bytes with word address X 0 0 1 0 1 0 1 is shown in Fig.8.
handbook, full pagewidth
Word Address X0000000 X0001... X0010101 X0011...
(1)
Row 0 1 2 3 4 5 6 1 2 3 1 2 3 4 5 6 7 8
column
0
1
2
3
4
5
6
7
MLB890
(1) X = don't care.
Fig.8 Writing eight and six bytes with different word addresses.
1997 Apr 02
7
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
PCA8581; PCA8581C
To transmit eight bytes in sequential order, begin with the lowest address bits 0 0 0. The data is written after a stop is detected. The data is only written if complete bytes have been received and acknowledged. Writing takes a time tWR (6 to 10 ms) during which the device will not respond to its slave address. Note that to write the next row, a new write operation is required (start, slave address, row address, data and stop).
handbook, full pagewidth
acknowledgement from slave
acknowledgement from slave
acknowledgement from slave
acknowledgement from master
S
SLAVE ADDRESS
0AX
WORD ADDRESS
A
S
SLAVE ADDRESS
1A
DATA
A
R/W don't care
at this moment master transmitter becomes master - receiver and PCA8581(C) slave - receiver becomes slave - transmitter
R/W
n bytes auto increment memory word address
no acknowledgement from master
DATA
1
P
last byte
MLB891
auto increment memory word address
Fig.9 Master reads after setting word address (WRITE word address; READ data).
handbook, full pagewidth
acknowledgement from slave
acknowledgement from slave
acknowledgement from slave
S
SLAVE ADDRESS
1A
DATA
A
DATA
1
P
R/W
n bytes auto increment word address
last bytes auto increment word address
MBD824
Fig.10 Master reads slave immediately after first byte (READ mode).
An unlimited number of data bytes can be read in one operation. The address is automatically incremented. If a read without setting the word address is performed after a write operation, the address pointer may point at a byte in the row after the previously written row. This occurs if, during writing, the three lowest address bits (column) rolled over. 1997 Apr 02 8
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI II IO Ptot PO Tamb Tstg PARAMETER supply voltage (pin 8) input voltage (any input) DC input current DC output current total power dissipation per package power dissipation per output operating ambient temperature storage temperature without EEPROM retention with EEPROM retention 9 HANDLING CONDITIONS
PCA8581; PCA8581C
MIN. -0.3 -0.8 - - - - -25 -65 -65
MAX. +7.0 10 10 150 50 +85 +150 +85 V VDD + 0.8 V
UNIT
measured via a 500 resistor
mA mA mW mW C C C
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under "Handling MOS Devices".
1997 Apr 02
9
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
PCA8581; PCA8581C
10 DC CHARACTERISTICS VDD = 2.5 to 6.0 V (PCA8581C); VDD = 4.5 to 5.5 V (PCA8581); VSS = 0 V; Tamb = -25 to +85 C; note 1; unless otherwise specified. SYMBOL Supply VDD supply voltage PCA8581C PCA8581 IDD supply current standby mode during read cycle during write cycle Inputs A0, A1, A2, SDA and SCL VIL VIH ILI Ci IOL tWR tRET Note 1. The PCA8581C is guaranteed to be programmed with all locations `FF' (hexadecimal) provided the device has been stored within the temperature limits -65 to +85 C. LOW level input voltage HIGH level input voltage input leakage current input capacitance VI = VDD or VSS VI = VSS - 0.7VDD - - - - - - - 0.3VDD - 1 7 - V V A pF fSCL = 0 Hz; VIL = 0 V; VIH = VDD fSCL = 100 Hz; VIL = 0 V; VIH = VDD VIL = 0 V; VIH = VDD - - - - - - 10 400 1000 A A A 2.5 4.5 - - 6.0 5.5 V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Output SDA LOW level output current VOL = 0.4 V write time data retention time 3 - 10 mA
Erase/write data 7 - 10 - ms years
1997 Apr 02
10
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
PCA8581; PCA8581C
11 AC CHARACTERISTICS All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and VIH with an input voltage swing of VSS to VDD. SYMBOL I2C-bus timing (see Fig.11; note 1) fSCL tSP tBUF tSU;STA tHD;STA tLOW tHIGH tr tf tSU;DAT tHD;DAT tVD;DAT tSU;STO Note 1. A detailed description of the I2C-bus specification, with applications, is given in brochure "The I2C-bus and how to use it". This brochure may be ordered using the code 9398 393 40011. SCL clock frequency tolerable spike width on bus bus free time START condition set-up time START condition hold time SCL LOW time SCL HIGH time SCL and SDA rise time SCL and SDA fall time data set-up time data hold time SCL LOW to data out valid STOP condition set-up time - - 4.7 4.7 4.0 4.7 4.0 - - 250 0 - 4.0 - - - - - - - - - - - - - 100 100 - - - - - 1.0 0.3 - - 3.4 - kHz ns s s s s s s s ns ns s s PARAMETER MIN. TYP. MAX. UNIT
handbook, full pagewidth
PROTOCOL
START CONDITION (S)
BIT 7 MSB (A7)
BIT 6 (A6)
BIT 0 LSB (R/W)
ACKNOWLEDGE (A)
STOP CONDITION (P)
t SU;STA
t LOW
t HIGH
1 / f SCL
SCL
t
BUF
tr
t
f
SDA
t HD;STA
t SU;DAT
t
HD;DAT
t VD;DAT
MBD820
t SU;STO
Fig.11 I2C-bus timing diagram; rise and fall times refer to VIL and VIH.
1997 Apr 02
11
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
12 APPLICATION INFORMATION 12.1 Application example
PCA8581; PCA8581C
handbook, full pagewidth
VDD
SDA
MASTER TRANSMITTER/ RECEIVER SCL
VDD
0 0 0
A0 A1 A2 TEST
SCL PCA8581/PCA8581C '1010' V SS SDA
VDD
VDD
1 0 0
A0 A1 A2 TEST
SCL PCA8581/PCA8581C '1010' V SS SDA
V DD
VDD VDD VDD
1 1 1
A0 A1 A2 TEST
SCL PCA8581/PCA8581C '1010' V SS SDA R R R: pull up resistor tr R= C BUS
MLB893
V DD
SDA
SCL
(I 2 C bus)
Inputs A0, A1 and A2 must be connected to VDD of VSS but not left open-circuit.
Fig.12 Application diagram.
1997 Apr 02
12
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
12.2 Slave address
PCA8581; PCA8581C
The PCA8581 has a fixed combination 1 0 1 0 as group 1, while group 2 is fully programmable (see Fig.13).
handbook, halfpage
1
0
1
0
A2
A1
A0 R/W
group 1
group 2
MLB892
Fig.13 Slave address.
12.3
Diode protection
handbook, halfpage
A0 A1 A2 VSS substrate
MLB894
VDD TEST SCL SDA
There is no connection between SCL and VDD, and SDA and VDD; this allows powering down the device without affecting I2C-bus operation.
Fig.14 Device diode protection.
1997 Apr 02
13
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
13 PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil)
PCA8581; PCA8581C
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001AN EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1997 Apr 02
14
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
PCA8581; PCA8581C
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03S JEDEC MS-012AA EIAJ EUROPEAN PROJECTION A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
ISSUE DATE 95-02-04 97-05-22
1997 Apr 02
15
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
14 SOLDERING 14.1 Introduction
PCA8581; PCA8581C
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 14.3.2 WAVE SOLDERING
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). 14.2 14.2.1 DIP SOLDERING BY DIPPING OR BY WAVE
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.3.3 REPAIRING SOLDERED JOINTS
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 14.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 14.3 14.3.1 SO REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Apr 02
16
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
15 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCA8581; PCA8581C
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 16 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1997 Apr 02
17
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
NOTES
PCA8581; PCA8581C
1997 Apr 02
18
Philips Semiconductors
Product specification
128 x 8-bit EEPROM with I2C-bus interface
NOTES
PCA8581; PCA8581C
1997 Apr 02
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
417067/1200/03/pp20
Date of release: 1997 Apr 02
Document order number:
9397 750 01747

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